What Are the Circuit Board Specifications?
| PRINTED CIRCUIT BOARD SPECIFICATIONS | |||
|---|---|---|---|
| STANDARD | ADVANCED | FUTURE | |
| Minimum Line Spacing | .005″ | .003″ | .002″ |
| Minimum Line Width | .005″ | .004″ | .002″ |
| Minimum Drilled Hole Size | .0079″ | .0079″ | .0059″ |
| Plated Hole Tolerance | +/- 0.003″ | +/- 0.002″ | +/- 0.001″ |
| Minimum Core Thickness | 0.010″ | 0.005″ | 0.004″ |
| Maximum PCB Thickness | 0.125″ | 0.125″ | 0.250″ |
| Thickness Tolerance (%) | +/- 0.007″ | +/- 0.007″ | +/- 0.005″ |
| Maximum Board Dimensions | 17.2″ x 23.2″ | 23.0″ x 23.0″ | |
| Bow and Twist (Through Hole) % | 1,50% | 1,25% | 1,00% |
| Bow and Twist (SMT) % | 0,75% | 0,75% | 0,50% |
| Solder Mask Clearance | 0.005″ | 0.003″ | 0.002″ |
| Maximum Layers | 12 | 16 | 24 |
| Maximum Copper Weight Internal (oz.) | 2 | 3 | 4 |
| Maximum Copper Weight External (oz.) | 3 | 6 | 10 |
| Materials | FR4 (130 Tg), FR4 (170 Tg), ROGERS (3003 – 4350), TACONIC (TLE95 – RF-30), ARLON DICLAD. Manufacturing on request. | ||
| Finish | Lead-free HASL (SN100CL), White Tin, ENIG, Silver, Nickel/Gold Plating, OSP | ||
| Minimum Trace on the Backprint | 0.007″ | 0.006″ | 0.005″ |
| Available Colors for Backprint | White, yellow, black, grey, blue, red or other custom colors | ||
| Available Colors for Solder Mask | Green, black, blue, white, red, grey or other custom colors | ||
